Substrate Processing Method, Storage Medium and Substrate Processing Apparatus
AssigneeTokyo Electron Limited
InventorsYoshichika Tokuno, Hiroshi Nagayasu
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Abstract
Provided is a substrate processing method that prevents generation of watermarks on a substrate and can be performed at a low cost. The method controls the ambient humidity around the substrate depending on the kind of the chemical liquid, when the substrate is processed with the chemical liquid. The control of the humidity is performed at least in a drying step that dries the substrate W. In one embodiment, the ambient humidity around the substrate is controlled when a fluid containing IPA as a drying fluid is supplied to the substrate W after processing the substrate W with the chemical liquid.
Claims23
A substrate processing method that processes a substrate with a chemical liquid and thereafter dries the substrate, comprising a step of controlling an ambient humidity around the substrate depending on a kind of the chemical liquid.
A substrate processing method that processes a substrate with a plurality of kinds of chemical liquids and thereafter dries the substrate, said method comprising:
- a first chemical liquid processing step that processes the substrate with a first chemical liquid;
- a second chemical liquid processing step that processes the substrate with a second chemical liquid after the first chemical liquid processing step;
- and
- a drying step that dries the substrate after the second chemical liquid processing step;
- wherein, at least in the drying step, ambient humidity of around the substrate is reduced to a lower level than that in the first chemical liquid processing step.
A substrate processing apparatus that processes a substrate with a chemical liquid, comprising:
- a plurality of chemical liquid supply sources that supply different kinds of chemical liquids, respectively;
- a humidity control mechanism that controls ambient humidity of around the substrate;
- and
- a controller that controls the humidity control mechanism;
- wherein the controller is configured to control the humidity around the substrate depending on the a kind of the chemical liquid.
A substrate processing apparatus that processes a substrate with a chemical liquid, comprising:
- a plurality of chemical liquid supply sources that supply different kinds of chemical liquids, respectively;
- a humidity control mechanism that controls ambient humidity of around the substrate;
- and
- a controller that controls the humidity control mechanism;
- wherein the controller is configured to control said apparatus such that a first chemical liquid processing step that processes the substrate with a first chemical liquid, a second chemical liquid processing step that processes the substrate with a second chemical liquid after the first chemical liquid processing step, and a drying step that dries the substrate after the second chemical liquid processing step, and configured to control the ambient humidity around the substrate such that the ambient humidity at least in the drying step is lower than that in the first chemical liquid processing step.
Dependencies are inferred from the claim text.