Substrate processing apparatus
AssigneeTokyo Electron Limited
InventorKazuo Sakamoto
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AssigneeTokyo Electron Limited
InventorKazuo Sakamoto
Estimating the term…
A substrate processing apparatus of the present invention includes a holding means for rotatably holding a substrate; a coating solution supply nozzle for supplying a coating solution onto a front surface of the substrate to be processed held by the holding means; a treatment chamber housing the holding means and the coating solution supply nozzle; a cooling means for cooling the substrate before the coating solution is supplied to the substrate, to a predetermined temperature; a heating means for heating the substrate coated with the coating solution to a predetermined temperature; and a transfer means for transferring the substrate between the treatment chamber, the cooling means and the heating means, wherein the treatment chamber, the cooling means and the heating means are partitioned from an ambient air, and wherein at least the treatment chamber is connected to a gas supply mechanism having a supply source of a gas having a kinematic viscosity coefficient higher than that of air and kept at a predetermined concentration of the gas.
A substrate processing apparatus comprising a holding means for rotatably holding a substrate to be processed;
A substrate processing apparatus comprising a holding means for rotatably holding a substrate to be processed;
Dependencies are inferred from the claim text.