Collapsable connection mold repair method utilizing femtosecond laser pulse lengths
AssigneeInternational Business Machines Corporation
InventorsTimothy E. Neary, Erik M. Probstfield
Life of this patent
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Abstract
A method for repairing molds for collapsible connections utilizing a femtosecond laser pulse length. Also provided is a laser source for implementing a multistep profile repair process for the removal of excess material in C4 molds by utilizing the femtosecond laser pulse lengths.
Claims20
A method of repairing at least one recess in semiconductor mold substrate surfaces, wherein said at least one recess is provided for the formation of collapsible connections, said recess being initially of an undersized or irregular defective configuration, deviating from a desired configuration, said method comprising:
- superimposing a pulsed laser source having an aperture in alignment over said at least one defective recess in said mold substrate surface;
- and
- applying femtosecond laser pulses to said at least one recess so as to remove material therefrom so as to impart said desired configuration to said at least one recess.
An ablating pulse laser for repairing at least one recess in semiconductor mold substrate surfaces, wherein said at least one recess is provided for the formation of collapsible connections, said recess being initially of an undersized or irregular defective configuration, deviating from a desired configuration, comprising:
- superimposing a pulsed laser source having an aperture in alignment over said at least one defective recess in said mold substrate surface;
- and
- applying femtosecond laser pulses to said at least one recess so as to remove material therefrom so as to impart said desired configuration to said at least one recess.
Dependencies are inferred from the claim text.