Manufacturing method for printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJee-Soo Mok, Jun-Heyoung Park
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Abstract
A manufacturing method for a printed circuit board is disclosed. The method includes: forming a first circuit pattern on a metal layer of a conductive carrier, which has the metal layer stacked on one side, pressing the conductive carrier and a first insulation layer together with the first circuit pattern facing the first insulation layer, forming a via by selectively removing the conductive carrier, and removing the metal layer. Using this method, a high-density thin package can be manufactured with increased reliability, and the productivity of the manufacturing process can also be improved.
Claims12
A method of manufacturing a printed circuit board, the method comprising:
- forming a first circuit pattern on a metal layer of a conductive carrier, the conductive carrier having the metal layer stacked on one side thereof;
- pressing the conductive carrier and a first insulation layer together such that the first circuit pattern faces the first insulation layer;
- forming a via by selectively removing the conductive carrier;
- and
- removing the metal layer.
Dependencies are inferred from the claim text.