Method for manufacturing crystal device

Abstract

A method for manufacturing a crystal device is provided. The method includes providing a package wafer including a plurality of internal and external connection terminals each having top and bottom ends respectively exposed to top and bottom surfaces of the package wafer; forming a height control member on the top end of the internal and external connection terminal and bonding one end of a crystal blank including an excitation electrode on the height control member; placing a bottom surface of a cap wafer having a cavity, which is open downward, on the top surface of the package wafer to which the crystal blank is mounted, and anodically bonding the package wafer with the cap wafer; and cutting the package wafer and the cap wafer in a direction across a bonding line formed by the bonding of the package wafer and the cap wafer to provide a plurality of crystal resonator that are individually separated.

Dependencies are inferred from the claim text.