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US 2008/0293341 A1Published application
Methods and apparatus for using a rolling backing pad for substrate polishing
AssigneeApplied Materials, Inc.
InventorsEashwer Kollata, Shou-Sung Chang, Zhenhua Zhang, Paul D. Butterfield, Sen-Hou Ko, Antoine P. Manens, Gary C. Ettinger, Ricardo Martinez
Life of this patent
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Abstract
An apparatus and method are provided to polish an edge of a substrate. The invention includes a polishing head including a backing pad, wherein a width of the backing pad that contacts the substrate edge is larger than a width of a notch in the substrate edge. Numerous other aspects are provided.
Claims25
An apparatus for polishing an edge of a substrate comprising:
- a polishing head including a backing pad, wherein a width of the backing pad that contacts a substrate edge is larger than a width of a notch in the substrate edge.
A system for polishing an edge of a substrate comprising:
- a substrate support adapted to rotate a substrate;
- a polishing head including a backing pad, wherein a width of the backing pad that contacts the substrate edge is larger than a width of a notch in the substrate edge;
- and
- a controller adapted to operate the rotation of the substrate and the polishing head.
1 more element
A method for polishing an edge of a substrate comprising:
- rotating a substrate;
- and
- contacting an edge of the substrate with a backing pad, wherein a width of the backing pad that contacts the substrate edge is larger than a width of a notch in the substrate edge the backing pad.
Dependencies are inferred from the claim text.