Methods and apparatus for controlling the size of an edge exclusion zone of a substrate
AssigneeApplied Materials, Inc.
InventorsZhenhua Zhang, Eashwer Kollata, Sen-Hou Ko
Life of this patent
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Abstract
In some embodiments, a method of controlling a width of an edge exclusion zone of a substrate is provided. The method includes determining a range of angles over which to rotate a polishing head; rotating the polishing head over the determined range of angles to achieve a preset width for an edge exclusion zone of the substrate; and polishing an edge of the substrate with the polishing head. Numerous other aspects are provided.
Claims22
A method of controlling a width of an edge exclusion zone on a substrate comprising:
- determining a range of angles over which to rotate a polishing head;
- rotating the polishing head over the determined range of angles to achieve a preset width for an edge exclusion zone of the substrate;
- and
- polishing an edge of the substrate with the polishing head.
A method of controlling a width of an edge exclusion zone on a substrate comprising:
- determining a radial position at which to place a polishing head with respect to a substrate so as to achieve a preset width of an edge exclusion zone for the substrate;
- moving the polishing head to the determined radial position;
- and
- polishing the substrate with the polishing head.
A method of controlling a width of an edge exclusion zone on a substrate comprising:
- providing a polishing head having a head spacer and a backing roller coupled to the head spacer at an off-center position and adapted to apply a polishing tape to a substrate during polishing;
- and
- applying the polishing tape to an edge exclusion zone of the substrate using the polishing head during polishing.
A system for controlling a width of an edge exclusion zone on a substrate comprising:
- a polishing head having a head spacer, wherein the polishing head is adapted to contact an edge of a substrate;
- a backing pad coupled to the head spacer at an off-center position;
- a polishing arm coupled to the polishing head;
- and
- a controller adapted to operate the polishing head and polishing arm to control an edge exclusion zone of the substrate.
Dependencies are inferred from the claim text.