Methods and apparatus for low cost and high performance polishing tape for substrate bevel and edge polishing in seminconductor manufacturing

An apparatus adapted to polish the edge of a substrate comprising:

• a polishing tape, the polishing tape comprising:
• a tape base having a first surface and a second surface;
• a resin layer adhering to the first surface of the tape base;
• and
• a plurality of abrasive beads affixed to the first surface by the resin layer, the plurality of abrasive beads comprising a plurality of abrasive particles suspended in binder material;
• wherein the plurality of abrasive beads and the resin layer comprise an abrasive side of the polishing tape adapted to contact the edge of the substrate.

A method for forming a polishing device adapted to polish a target surface, the method comprising:

• forming a plurality of abrasive beads comprising a plurality of abrasive particles suspended in binder material;
• and,
• affixing the plurality of abrasive beads by a resin layer to a first surface of a device base;
• wherein the plurality of abrasive beads and the resin layer comprise an abrasive side of the polishing device adapted to contact the target surface.

A method for polishing an edge of a substrate, the method comprising:

• holding a substrate with a holding device located away from a edge of the substrate;
• rotating the substrate by rotating the holding device;
• applying a polishing tape to the edge while the substrate is rotating;
• and
• advancing the polishing tape while the polishing tape is being applied to the edge;
• wherein the polishing tape is the only apparatus that contacts the edge while the substrate is rotating.

A method for forming a polishing tape adapted to polish an edge of a substrate, the method comprising:

• affixing a plurality of embossed abrasive particles by a resin layer to a first surface of a tape base;
• wherein the plurality of embossed abrasive particles and the resin layer comprise an abrasive side of the polishing tape adapted to contact the edge of the substrate;
• wherein the abrasive side is compatible with a chemical slurry for use in polishing the edge of the substrate;
• and
• wherein the chemical slurry has an abrasive or corrosive effect on the edge of the substrate.