Contact made of ceramic and its manufacturing method

A manufacturing method of a contact comprising:

• a step 1a of forming a first resist in a conical shape on the surface of a wiring substrate of a probe card;
• a step 1b of forming a second resist in the shape of a film on the surface of the conical first resist, and patterning a solid spiral groove in the second resist;
• a step 1c of jetting ceramic onto the conical first resist that has the second resist on its surface to form a film, and thereby forming a spring portion made of ceramic inside the groove formed in the second resist;
• a step 1d of removing the second resist and the first resist after the formation of the spring portion;
• a step 1e of forming a seed film on the surface of the spring portion and the surface of the wiring substrate by sputtering after the removal of the second resist and the first resist;
• a step if of forming a third resist in the shape of a film on the surface of the seed film and the surface of the wiring substrate, and performing on the third resist the patterning of exposing the seed film formed on the surface of the spring portion and on the surface of the wiring substrate from the spring portion to a wiring line formed on the wiring substrate;
• a step 1g of forming a conductive portion by plating on the surface of the seed film exposed from the third resist;
• and
• a step 1h of removing the third resist after the formation of the conductive portion, and removing the seed film exposed by the removal of the third resist.

A manufacturing method of a contact comprising:

• a step 2a of forming a first resist in a conical shape on the surface of a wiring substrate of a probe card;
• a step 2b of forming a back-side seed film by sputtering on the surface of the first resist and the surface of the wiring substrate;
• a step 2c of forming a second resist in the shape of a film on the surface of the back-side seed film, and patterning a solid spiral groove in the second resist;
• a step 2d of forming a back-side conductive portion in the shape of a film on the back-side seed film exposed from the groove of the second resist;
• a step 2e of jetting ceramic onto the surface of the back-side conductive portion and the surface of the second resist to form a film, and thereby forming a spring portion made of ceramic on the surface of the back-side conductive portion exposed from the groove of the second resist;
• a step 2f of removing the second resist after the formation of the spring portion;
• a step 2g of removing the back-side seed film exposed by the removal of the second resist;
• a step 2h of removing the first resist after the removal of the back-side seed film;
• a step 2i of forming a surface-side seed film by sputtering on the surface of the spring portion and the surface of the wiring substrate so as to be electrically connected to the back-side seed film formed at the back of the back-side conductive portion after the removal of the first resist;
• a step 2j of forming a third resist in the shape of a film on the surface-side seed film formed on the surface of the wiring substrate;
• a step 2k of forming a surface-side conductive portion on the surface-side seed film exposed after the formation of the third resist;
• and a step 2l of removing the third resist after the formation of the surface-side conductive portion, and removing the surface-side seed film exposed by the removal of the third resist.

A manufacturing method of a contact comprising:

• a step 3a of forming a first resist in a conical shape on the surface of a wiring substrate of a probe card;
• a step 3b of forming a back-side seed film by sputtering on the surface of the first resist and the surface of the wiring substrate;
• a step 3c of forming a second resist in the shape of a film on the surface of the back-side seed film, and patterning a solid spiral groove in the second resist;
• a step 3d of forming a back-side conductive portion in the shape of a film on the back-side seed film exposed from the groove of the second resist;
• a step 3e of removing the second resist after the formation of the back-side conductive portion, removing the back-side seed film exposed by the removal of the second resist, and removing the first resist after the removal of the back-side seed film;
• a step 3f of jetting ceramic onto the surface of the back-side conductive portion exposed by the removal of the second resist to form a film, and thereby forming a spring portion made of ceramic on the surface of the back-side conductive portion;
• a step 3g of forming a surface-side seed film by sputtering on the surface of the spring portion and the surface of the wiring substrate so as to be electrically connected to the back-side seed film formed at the back of the back-side conductive portion after the removal of the spring portion;
• a step 3h of forming a third resist in the shape of a film on the surface-side seed film formed on the surface of the wiring substrate;
• a step 3i of forming a surface-side conductive portion on the surface-side seed film formed on the surface of the spring portion, after the formation of the third resist;
• and
• a step 3j of removing the third resist after the formation of the surface-side conductive portion, and removing the surface-side seed film exposed by the removal of the third resist.