Arrangement of at least one power semiconductor module and a printed circuit board

An arrangement comprising:

• a printed circuit board having strip conductors;
• a power semiconductor module including a module housing and power terminals which extend to the exterior of the module housing and into contact with the strip conductors;
• a heat sink disposed on a side of the power semiconductor module opposite the printed circuit board;
• elastically or plastically deformable means disposed between the module housing and the printed circuit board, the deformable means being configured to relieve a contact pressure load on the power terminals by transferring the load from the printed circuit board to the housing;
• and
• at least one contact-pressure element disposed on a side of the printed circuit board opposite the power semiconductor module, wherein the contact-pressure element is integral with a first housing part of an arrangement housing, and the heat sink is integral with a second housing part of the arrangement housing, the two housing parts enclosing the printed circuit board.