Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment

A method of manufacturing a semiconductor device comprising:

• forming a first conductive layer over a semiconductor wafer on which a plurality of integrated circuits are formed so that the first conductive layer is electrically connected with electrodes of the semiconductor wafer;
• forming an insulating layer so that at least a part of the insulating layer is disposed on the first conductive layer;
• forming a second conductive layer so that at least a part of the second conductive layer is disposed on the insulating layer over the first conductive layer;
• and
• cutting the semiconductor wafer,
• wherein each of the first and second conductive layers is formed by discharging drops of a solvent containing fine particles of a conductive material, and
• wherein the insulating layer is formed by discharging drops of a solvent containing fine particles of an insulating material.