Method of manufacturing chip integrated substrate
AssigneeShinko Electric Industries Co., Ltd.
InventorToshio Kobayashi
Life of this patent
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Abstract
There are provided the steps of connecting a chip component 13 to a first substrate 10 through wire bonding, providing, on a second substrate 20, an electrode 21 having a solder coat 23 coated with a copper core 22, polishing a portion of the electrode 21 which is to be bonded to the connecting pad 12, thereby exposing the copper core 22 from the solder coat 23, bonding the exposed portion of the copper core 22 to the bump connecting pad 12 by using a flux non-containing conductive paste 30, thereby bonding the substrates 10 and 20 to each other, and filling a sealing resin 40 in a clearance portion between the substrates 10 and 20.
Claims10
A method of manufacturing a chip integrated substrate comprising the steps of:
- connecting a chip component to a first substrate having a connecting pad formed thereon through wire bonding;
- providing, on a second substrate, an electrode having a metal core coated with a solder film;
- polishing a portion of the electrode which is to be bonded to the connecting pad to remove the solder film to expose the metal core;
- bonding the connecting pad to the portion of the electrode from which the metal core is exposed by using a flux non-containing conductive bonding member, and bonding the first substrate to the second substrate in such a manner that the chip component is provided therein;
- and
- filling a resin in a clearance portion between the first substrate and the second substrate.
A method of manufacturing a chip integrated substrate comprising the steps of:
- connecting a chip component to a first substrate having a connecting pad formed thereon through wire bonding;
- providing, on a second substrate, an electrode formed by a metallic material and protruded from a substrate surface;
- bonding the connecting pad to the electrode by using a flux non-containing conductive bonding member, and bonding the first substrate to the second substrate in such a manner that the chip component is provided therein;
- and
- filling a resin in a clearance portion between the first substrate and the second substrate.
Dependencies are inferred from the claim text.