Standoff Height Improvement for Bumping Technology Using Solder Resist
AssigneeSTATS ChipPAC, Ltd.
InventorsTaeWoo KANG, YoRim LEE, TaeKeun LEE
Life of this patent
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Abstract
A system to support a die includes a substrate. A solder resist is disposed over the substrate. A first solder bump is disposed in the solder resist to provide electrical connectivity through the solder resist to the substrate. A second solder bump is formed over the solder resist to correspond with a peripheral edge or a corner of the die. The second solder bump provides standoff height physical support to the die.
Claims29
A method of controlling a standoff height in a semiconductor device having an integrated die with a peripheral edge, comprising:
- providing a substrate;
- depositing a solder resist film laminate layer over the substrate;
- forming an opening in the solder resist film laminate layer;
- depositing a metal plate in the opening;
- forming a first solder bump over the plate;
- and
- forming a second solder bump over the solder resist to correspond to the peripheral edge of the die.
A semiconductor device to support an integrated die having a peripheral edge, comprising:
- a substrate;
- a solder resist film laminate disposed over the substrate;
- an opening formed in the solder resist film laminate layer;
- a metal plate deposited in the opening;
- a first solder bump formed over the plate;
- and
- a second solder bump formed over the solder resist to correspond to the peripheral edge of the die.
A system to support a die, comprising:
- a substrate;
- a solder resist disposed over the substrate;
- a first solder bump disposed in the solder resist to provide electrical connectivity through the solder resist to the substrate;
- and
- a second solder bump formed over the solder resist to correspond with a peripheral edge or a corner of the die, the second solder bump providing standoff height physical support to the die.
A method of manufacturing a system to support a die, comprising:
- providing a substrate;
- providing a solder resist disposed over the substrate;
- providing a first solder bump disposed in the solder resist to provide electrical connectivity through the solder resist to the substrate;
- and
- providing a second solder bump formed over the solder resist to correspond with a peripheral edge or a corner of the die, the second solder bump providing standoff height physical support to the die.
Dependencies are inferred from the claim text.