Semiconductor package
AssigneeInternational Business Machines Corporation
InventorsTOHRU NAKANISHI, KOSEI TANAHASHI
Life of this patent
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Abstract
There is provided a semiconductor package including: a substrate having a plurality of electrode pads on a surface thereof; a semiconductor chip mounted on the substrate, the semiconductor chip electrically connecting with the plurality of electrode pads; and a stiffener arranged on the substrate so as to surround the semiconductor chip. The stiffener includes: an insulating material layer; and a rigid plate mounted substantially parallel to a surface of the substrate in the insulating material layer, the rigid plate having formed therein a plurality of through holes, at least a part of the through holes being filled with the insulating material.
Claims1
A method of forming a semiconductor package, comprising:
- preparing a substrate having a plurality of electrode pads on a surface thereof;
- mounting a semiconductor chip on the substrate, the semiconductor chip electrically connecting with the plurality of electrode pads;
- forming an underfill between the surface of the substrate and the semiconductor chip;
- and
- forming a stiffener on the substrate so as to surround the semiconductor chip, wherein the step of forming the stiffener further comprises:
- forming a first insulating material layer around the semiconductor chip on the substrate;
- mounting a rigid plate provided with a plurality of through holes on the first insulating material layer;
- and
- forming a second insulating material layer on the first insulating material layer so as to cover the rigid plate, at least a part of the plurality of through holes of the rigid plate being simultaneously filled with an insulating material.
Dependencies are inferred from the claim text.