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US 2008/0293190 A1Published application
Semiconductor package, method for fabricating the same, and semiconductor device
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsHisaho Inao, Tetsuya Hirano, Katsutoshi Shimizu
Life of this patent
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Abstract
A semiconductor device includes a semiconductor chip, leads for sending and receiving signals between the semiconductor chip and an external device, fine metal wires, an encapsulant for sealing the leads, and a lid member. On the surface of each of the leads, a metal oxide film is formed by an oxidation treatment. The metal oxide film has a thickness larger than a natural oxide film and no more than 80 nm.
Claims4
1-4. (canceled)
A method for fabricating a semiconductor package, comprising the steps of:
- (a) preparing a leadframe having a frame body and a plurality of leads which are connected at the proximal ends to the frame body and the distal ends of which are to face a region for mounting a semiconductor chip;
- (b) forming a metal oxide film having a thickness of no less than 1.7 nm and no more than 80 nm on the surface of the leadframe by subjecting the leadframe to an oxidation treatment;
- and
- (c) forming an encapsulant with a molding material to seal parts of the plurality of leads.
1 more element
Dependencies are inferred from the claim text.