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US 2008/0293188 A1Published application
Reactive solder material
OwnerFay Hua, Carl L. Deppisch +1inventors
InventorsFay Hua, Carl L. Deppisch, Krista J. Whittenburg
Life of this patent
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Abstract
Reactive solder material. The reactive solder material may be soldered to semiconductor surfaces such as the backside of a die or wafer. The reactive solder material includes a base solder material alloyed with an active element material. The reactive solder material may also be applied to a portion of a thermal management device. The reactive solder material may be useful as a thermally conductive interface between a semiconductor surface and a thermal management device.
Claims7
A method comprising:
- applying a reactive solder material to a semiconductor surface;
- and
- soldering the reactive solder material to secure a thermal management device to the semiconductor surface in a fluxless manner.
A method comprising:
- applying a reactive solder material to a portion of a thermal management device;
- and
- soldering the reactive solder material in a fluxless manner.
Dependencies are inferred from the claim text.