Method for evaluating a gate insulation film characteristic for use in a semiconductor device
AssigneeSeiko Epson Corporation
InventorsMasayasu Miyata, Masamitsu Uehara
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AssigneeSeiko Epson Corporation
InventorsMasayasu Miyata, Masamitsu Uehara
Estimating the term…
A gate insulating film 3 is formed of an insulative inorganic material containing silicon and oxygen as a main material. The gate insulating film 3 contains hydrogen atoms. A part of the absorbance of infrared radiation of which wave number is in the range of 830 to 900 cm−1 is less than both the absorbance of infrared radiation at the wave number of 830 cm−1 and the absorbance of infrared radiation at the wave number of 900 cm−1 when the insulating film to which an electric field has never been applied is measured by means of Fourier Transform Infrared Spectroscopy at room temperature. Further, in the case where the absolute value of the difference between the absorbance of infrared radiation at the wave number of 830 cm−1 and the absorbance of infrared radiation at the wave number of 770 cm−1 is defined as A and the absolute value of the difference between the absorbance of infrared radiation at the wave number of 900 cm−1 and the absorbance of infrared radiation at the wave number of 990 cm−1 is defined as B, then A and B satisfy the relation: A/B is 1.8 or more.
A method for evaluating a gate insulation film characteristic for use in a semiconductor device, the semiconductor device including a semiconductor substrate having a source region, a drain region, a channel region provided between the source region and the drain region and an element separate structure surrounding the source region, the drain region and the channel region, the gate insulation film being provided so as to cover the semiconductor substrate, and a gate electrode provided so as to face the channel region via the gate insulation film, and wherein the gate insulation film is formed of an insulative inorganic material as a main material, the insulative inorganic material containing silicon and oxygen, the gate insulating film further containing hydrogen atoms, the method comprising:
Dependencies are inferred from the claim text.