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US 2008/0293168 A1Published application
Method and system of tape automated bonding
AssigneeCardiac Pacemakers, Inc.
InventorsNick A. Youker, Ronald L. Anderson, John E. Hansen
Life of this patent
Estimating the term…
Abstract
A tape automated bonding (TAB) structure which includes a flex tape having a conductive lead pattern formed thereon. The conductive lead pattern includes a plurality of leads configured to form an inner lead bond (ILB) portion of the TAB structure. At least one of the plurality of leads is internally routed and has a contact exposed interior to the ILB portion of the TAB structure.
Claims20
A method of manufacturing an electrical device, the method comprising:
- connecting an IC chip to a circuit board by a TAB leadframe structure;
- positioning an electronic component above a surface of the IC chip;
- and
- connecting the electronic component to the IC chip via a lead on the TAB leadframe which extends from the electrical component to a perimeter I/O of the IC chip.
1 more element
A method comprising:
- connecting an IC chip to a circuit board by a TAB leadframe structure;
- positioning an electrical component on or above a surface of the IC chip;
- and
- electrically connecting the electrical component to the IC chip by a lead on the TAB leadframe, the lead positioned along a surface of the TAB leadframe such that the lead extends from a point which is within an inner portion of the leadframe outward toward an outer portion of the leadframe such that the lead extends from the electrical component to a perimeter I/O of the IC chip.
1 more element
A method comprising:
- connecting an IC chip to a circuit board by a TAB leadframe structure, the IC chip having a plurality of perimeter I/Os, and the TAB leadframe including a plurality of leads, a first area of the plurality of leads configured into a generally rectangular ILB portion which is dimensioned to directly connect one or more of the plurality of leads to the perimeter I/Os of the IC chip, a second area of the plurality of leads configured into an OLB portion for connecting one or more of the plurality of leads to the circuit board, wherein at least one of the plurality of leads extends within the ILB area so that the at least one lead has a first end located outside the ILB portion and a second end having a contact exposed interior to the ILB portion of the TAB structure and above a major surface of the IC chip;
- and
- positioning an electrical component on or above a surface of the IC chip;
- and
- electrically connecting the electrical component to the IC chip by the at least one lead which has a contact exposed interior to the ILB portion of the TAB structure and above a major surface of the IC chip.
2 more elements
Dependencies are inferred from the claim text.