Light source module, backlight assembly having the same, display apparatus having the backlight assembly, and method thereof
AssigneeSamsung Electronics Co., Ltd.
InventorsSeung-Gyun WOO, Young-Bee CHU, Ik-Soo LEE
Life of this patent
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Abstract
A light source module includes a power supply plate, a light emitting chip, and a body mold. The light emitting chip is disposed on the power supply plate to lean to one side with respect to a center of the power supply plate along a first direction and electrically connected to the power supply plate. The body mold is connected with the power supply plate to expose the light emitting chip. Therefore, a thickness of a backlight assembly employing the light source module may be reduced.
Claims21
A light source module comprising:
- a power supply plate;
- a light emitting chip disposed on the power supply plate to lean to one side of the power supply plate with respect to a center of the power supply plate along a first direction, the light emitting chip being electrically connected to the power supply plate;
- and
- a body mold connected with the power supply plate to expose the light emitting chip.
A backlight assembly comprising:
- a light source module comprising:
- a power supply plate;
- a light emitting chip disposed on the power supply plate to lean to a first side of the power supply plate with respect to a center of the power supply plate along a first direction, the light emitting chip being electrically connected to the power supply plate;
- and
- a body mold connected with the power supply plate to expose the light emitting chip;
- and
- a light guide plate including a side surface facing the light emitting chip and receiving light generated by the light emitting chip, and a light exiting surface through which the light received through the side surface exits from the light guide plate.
A display apparatus comprising:
- a display panel displaying an image using light;
- and
- a backlight assembly comprising:
- a light source module including:
- a power supply plate;
- a light emitting chip disposed on the power supply plate to lean to a first side of the power supply plate with respect to a center of the power supply plate along a first direction, the light emitting chip being electrically connected to the power supply plate;
- and
- a body mold connected with the power supply plate to expose the light emitting chip;
- and
- a light guide plate including a side surface facing the light emitting chip and receiving light generated by the light emitting chip, and a light exiting surface through which the light received through the side surface exits from the light guide plate toward the display panel.
A method of reducing a thickness of a backlight assembly, the method comprising:
- providing a power supply plate with a width in a first direction and a length in a second direction, the power supply plate having a first long side and a second long side extending in the second direction;
- disposing a light emitting chip having a width in the first direction and a length in the second direction on the power supply plate closer to the first long side than to the second long side;
- surrounding the power supply plate with a body mold and exposing the light emitting chip through an opening in the body mold, the body mold having a width in the first direction;
- and,
- arranging a light guide plate adjacent the opening in the body mold, a thickness of the light guide plate being less than the width of the body mold.
Dependencies are inferred from the claim text.