Light emitting diode back light module
AssigneesEverlight Electronics Co., Ltd., National Cheng Kung University
InventorChieng-Chang Pei
Life of this patent
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Abstract
An LED back light module includes a metal support, a thermal conductive material, a circuit board and at least one light emitting diode. The metal support has a recess and a plurality of holes. The thermal conductive material has a first surface in contact with a bottom of the recess. The circuit board is disposed on a second surface of the thermal conductive material, in which the circuit board has a plurality of flanges lodged into the holes of the metal support for compacting the circuit board, the thermal conductive material and the metal support. The light emitting diode is disposed on the circuit board, in which the thermal energy generated by the light emitting diode is delivered to the metal support through the circuit board and the thermal conductive material.
Claims20
A light emitting diode back light module, comprising:
- a metal support, having a recess and a plurality of holes;
- a thermal conductive material, having a first surface in contact with a bottom of the recess;
- a circuit board, disposed on a second surface of the thermal conductive material, wherein the second surface is opposite to the first surface, and the circuit board has a plurality of flanges lodged into the holes of the metal support to compact the circuit board, the thermal conductive material and the metal support;
- and
- at least one light emitting diode disposed on the circuit board, wherein the thermal energy generated by the light emitting diode is delivered to the metal support through the circuit board and the thermal conductive material.
A light emitting diode back light module, comprises:
- a metal support, having a recess and a plurality of holes;
- a thermal conductive material, having a bottom-side surface in contact with a bottom of the recess;
- a circuit board, having a first surface in contact with a board-side surface of the thermal conductive material;
- at least one light emitting diode, disposed on a second surface of the circuit board, wherein the second surface is opposite to the first surface;
- and
- at least one elastic element, having two ends lodged in the holes of the metal support, wherein a main part of the elastic element presses the circuit board for compacting the circuit board, the thermal conductive material and the metal support.
Dependencies are inferred from the claim text.