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US 2008/0290992 A1Published application
Semiconductor device with integrated coils
AssigneeInfineon Technologies Austria AG
InventorsJosef Hoeglauer, Bernhard Knott
Life of this patent
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Abstract
A semiconductor device with a number of integrated coils is disclosed. In one embodiment, a first coil portion and a second coil portion are at least in part overlapping each other. Another embodiment provides a process for manufacturing a semiconductor device having at least the processes of generating a first coil portion, generating a second coil portion, wherein at least a part of the first coil portion and a part of the second coil portion are overlapping each other.
Claims40
A semiconductor device comprising:
- a number of integrated coils, wherein a first coil portion and a second coil portion are at least in part overlapping each other.
A method for manufacturing a semiconductor device comprising:
- generating a first coil portion;
- generating a second coil portion;
- wherein at least a part of the first coil portion and a part of the second coil portion are overlapping each other.
A system comprising:
- a semiconductor device having a number of integrated coils, wherein a first coil portion and a second coil portion are at least in part overlapping each other;
- and
- an integrated circuit coupled to the semiconductor device.
Dependencies are inferred from the claim text.