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US 2008/0290980 A1Published application
Control of eddy currents in magnetic vias for inductors and transformers in integrated circuits
AssigneeIntel Corporation
InventorsDonald S. Gardner, Gerhard Schrom, Peter Hazucha, Fabrice Paillet, Tanay Karnik
Life of this patent
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Abstract
An embodiment is a magnetic via. More specifically, an embodiment is a magnetic via that increases the inductance of, for example, an integrated inductor or transformer while mitigating eddy currents therein that may limit the operation of the inductor or transformer at high frequency.
Claims20
An inductor comprising;
- a first layer of magnetic material;
- one or more metal lines formed on the first layer of magnetic material;
- a second layer of magnetic material;
- and
- one or more magnetic vias to couple the first layer of magnetic material, wherein one or more of the magnetic vias comprises a magnetic material different from the magnetic material of the first and second layer and having a higher resistivity compared to the first layer.
2 more elements
An integrated circuit comprising:
- an integrated circuit device;
- and
- an inductor coupled to the integrated circuit device, the inductor including one or more metal lines disposed between and substantially insulated from a first layer of magnetic material and a second layer of magnetic material;
- and
- one or more magnetic vias to couple the first layer of magnetic material to the second layer of magnetic material, wherein one or more of the magnetic vias comprises a magnetic material different from the magnetic material of the first and second layer and having a higher resistivity compared to the first layer.
2 more elements
A system comprising:
- an off-chip power source;
- and
- an integrated circuit coupled to the off-chip power source, the integrated circuit including one or more power converters, each power converter including an inductor, the inductor including:
- one or more metal lines disposed between and substantially insulated from a first layer of magnetic material and a second layer of magnetic material;
- and
- one or more magnetic vias to couple the first layer of magnetic material to the second layer of magnetic material, wherein one or more of the magnetic vias comprises a magnetic material different from the magnetic material of the first and second layer and having a higher resistivity compared to the first layer.
3 more elements
A method comprising:
- forming a first layer of magnetic material;
- forming a first layer of insulator on the first layer of magnetic material;
- forming metal lines on the first layer of insulator;
- forming a second layer of insulator about the metal lines;
- patterning and etching the first and second layers of insulator to expose a portion of the first layer of magnetic material;
- and
- forming a second layer of magnetic material coupled to a magnetic via, wherein one or more of the magnetic vias comprises a magnetic material different from the magnetic material of the first and second layer and having a higher resistivity compared to the first layer.
4 more elements
Dependencies are inferred from the claim text.