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US 2008/0290964 A1Published application
Branching filter package
AssigneeOki Electronic Industry Co., Ltd.
InventorsWataru Ohashi, Hajime Shimamura, Tomokazu Komazaki, Yoshiaki Fujita
Life of this patent
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Abstract
A branching filter package has a SAW filter chip housing area which houses a piezo electric base, on which a transmitting SAW filter and a receiving SAW filter having a different frequency passing band with each other, are formed, and an impedance matching circuit and a branching circuit for the transmitting SAW filter and the receiving SAW filter.
Claims18
1-7. (canceled)
A surface acoustic wave (SAW) duplexer comprising:
- a transmitting SAW filter having a first input portion and a first output portion;
- a receiving SAW filter having a second input portion and a second output portion;
- and
- a single piezoelectric substrate on which the transmitting and receiving SAW filters are arranged in series in an arranging direction, wherein the single piezoelectric substrate has first and second sides which face each other in an orthogonal direction, the orthogonal direction being orthogonal to the arranging direction;
- wherein the first output portion of the transmitting SAW filter is positioned closer to the first side than the second side, and the second input portion of the receiving SAW filter is positioned closer to the second side than the first side.
2 more elements
Dependencies are inferred from the claim text.