Probe test system and method for testing a semiconductor package
AssigneeTexas Instruments Incorporated
InventorAkira Matsunami
Life of this patent
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Abstract
In a method and system for testing a device under test (DUT), a replaceable test connector (RTC) is disposed between a probe pin of a tester and the DUT. The RTC includes an upper test bond pad that is electrically coupled to a lower test bond pad. The probe pin is capable of being positioned to make a physical contact with the upper test bond pad, the physical contact enabling an electrical coupling there between. The lower test bond pad is capable of being positioned to make physical contact with a device bond pad of the DUT, the physical contact enabling an electrical coupling between the lower test bond pad and the device bond pad. The device bond pad is protected from potential damage from the probe pin by the RTC that is replaceable.
Claims22
A test system comprising:
- a tester having a probe pin;
- a replaceable test connector (RTC) having an upper test bond pad that is electrically coupled to a lower test bond pad, wherein the probe pin is capable of being positioned to make a physical contact with the upper test bond pad, thereby enabling an electrical coupling between the probe pin and the upper test bond pad;
- and
- a device under test (DUT) having a device bond pad, wherein the lower test bond pad is capable of being positioned to make a physical contact with the device bond pad, thereby enabling an electrical coupling between the lower test bond pad and the device bond pad.
A method for testing a device under test (DUT), the method comprising:
- isolating a probe pin of a tester from making a physical contact with a device bond pad of the DUT to perform the testing by disposing a replaceable test connector (RTC) between the probe pin and the DUT;
- placing the RTC on to the DUT, wherein the placing enables a lower test bond pad of the RTC to make a physical contact with the device bond pad, thereby enabling an electrical coupling between the lower test bond pad and the device bond pad;
- and
- touching an upper test bond pad of the RTC with the probe pin, wherein the touching enables the probe pin to make a physical contact with the upper test bond pad, thereby enabling an electrical coupling between the upper test bond pad and the probe pin, wherein the upper test bond pad is electrically coupled to the lower test bond pad.
A method for testing a device under test (DUT), the method comprising:
- replicating an array of device bond pads of the DUT on a replaceable test connector (RTC), wherein the replicating provides the RTC having a matching array of lower test bond pads located on a lower surface of the RTC and a matching array of upper test bond pads located on an upper surface of the RTC;
- stacking the RTC on to the DUT to vertically align each pad of the array of device bond pads with a corresponding pad of the array of lower test bond pads, wherein the stacking causes the each pad of the array of lower test bond pads to make a physical contact with the corresponding pad of the array of device bond pads, the physical contact also enabling an electrical coupling there between;
- aligning a probe pin with a selected one of the array of upper test bond pads located on the upper surface, wherein the aligning enables the probe pin to make a physical contact with the selected one;
- and
- applying pressure on the probe pin to make the physical contact, thereby enabling an electrical coupling between the selected one and the probe pin, wherein each pad in the array of upper test bond pads is electrically coupled to a corresponding pad in the array of lower test bond pads.
Dependencies are inferred from the claim text.