Probe card assembly with ZIF connectors, method of assembling, wafer testing system and wafer testing method introduced by the same

A method of assembling ZIF connectors and a probe card, comprising the steps of:

• providing a substrate means, having a first surface, a second surface, a plurality of concave sections disposed on the second surface and a plurality of first through-holes perpendicular to said first surface and said concave sections, said plurality of first through-holes being circularly arranged toward a center of said substrate means;
• providing a plurality of ZIF connectors circularly arranged on said first surface of said substrate means toward said center of said substrate means, each of said plurality of ZIF connectors having parallelly arranged second through-holes from the top to the bottom of said ZIF connectors and pairs of electric terminals being deposed on the bottom of each ZIF connector for contacting said substrate means;
• and
• providing a plurality of detachably adjustable fastening means disposed through said first through-holes and said second through-holes for assembling and disassembling said ZIF connectors on said first surface of said substrate means.

A wafer prober with a probe card, having at least a moving table and a probe card, wherein said moving table provides movements along the X-Y-Z axes for loading a wafer under test, and wherein said probe card comprises:

• a substrate means, having a first surface, a second surface, a plurality of concave sections disposed on the second surface and a plurality of first through-holes perpendicular to said first surface and said concave sections, and said plurality of first through-holes being circularly arranged toward a center of said substrate means;
• a plurality of ZIF connectors being circularly arranged on said first surface of said substrate means toward said center of said substrate means, each of said plurality of ZIF connectors having parallelly arranged second through-holes from the top to the bottom of said ZIF connectors and pairs of electric terminals being deposed on the bottom of each ZIF connector for contacting said substrate means;
• and
• a plurality of detachably adjustable fastening means being disposed through said first through-holes and said second through-holes for assembling and disassembling said ZIF connectors on said first surface of said substrate means.

A wafer testing system, comprising:

• a wafer prober having at least a moving table, a probe card chuck, and a probe card, wherein said moving table provides movements along the X-Y-Z axes for loading a wafer under test, comprising:
• a substrate means, having a first surface, a second surface, a plurality of concave sections disposed on the second surface and a plurality of first through-holes perpendicular to said first surface and said concave sections, and said plurality of first through-holes being circularly arranged toward a center of said substrate means;
• a plurality of ZIF connectors being circularly arranged on said first surface of said substrate means toward said center of said substrate means, each of said plurality of ZIF connectors having parallelly arranged second through-holes from the top to the bottom of said ZIF connectors and pairs of electric terminals being deposed on the bottom of each ZIF connector for contacting said substrate means;
• and
• a plurality of detachably adjustable fastening means being disposed through said first through-holes and said second through-holes for assembling and disassembling said ZIF connectors on said first surface of said substrate means;
• a tester with female plugs for connecting the plurality of corresponding ZIF connectors;
• a controlling and processing means for receiving a test signal of said tester to calculate a wafer testing result;
• and
• a displaying means for outputting said calculated wafer testing result.

A wafer testing method, comprising the steps of:

• providing a wafer under test;
• providing a wafer prober which has at least a moving table, and a probe card, wherein said moving table provides movements along the X-Y-Z axes for loading a wafer under test, and wherein said probe card is chucked on said probe card chuck, comprising:
• a substrate means, having a first surface, a second surface, a plurality of concave sections disposed on the second surface and a plurality of first through-holes perpendicular to said first surface and said concave sections, and said plurality of first through-holes being circularly arranged toward a center of said substrate means;
• a plurality of ZIF connectors being circularly arranged on said first surface of said substrate means toward said center of said substrate means, each of said plurality of ZIF connectors having parallelly arranged second through-holes from the top to the bottom of said ZIF connectors and pairs of electric terminals being deposed on the bottom of each ZIF connector for contacting;
• and
• a plurality of detachably adjustable fastening means being disposed through said first through-holes and said second through-holes for assembling and disassembling said ZIF connectors on said first surface of said substrate means;
• providing a tester with female plugs for connecting the plurality of corresponding ZIF connectors;
• providing a controlling and processing means for receiving a test signal of said tester to calculate a wafer testing result;
• and
• providing a displaying means for outputting said calculated wafer testing result.