Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication

A semiconductor device comprising:

• a first substrate including a flat body having a first surface for mounting an electronic component and a second surface substantially parallel to the first surface, the first and second surfaces being disposed parallel to each other in the width direction of the substrate;
• wherein the first substrate includes,
• a first region on the flat body for mounting the electronic component,
• a second region on the flat body including a plurality of first communication units for transmitting and receiving signals to and from a second substrate, the plurality of first transmission units being provided in a cluster,
• input-output circuits disposed on the first region or the second region, the input-out circuits corresponding to the first communication units, each of the input-output circuits including an output circuit for outputting a signal to a second communication unit of the second substrate corresponding to the first communication unit and an input unit for receiving a signal sent from the corresponding second communication unit;
• and
• a control circuit for controlling input to and output from the input-output circuits, the control circuit being disposed on the first region or the second region of the first substrate.