Semiconductor package
AssigneeInternational Business Machines Corporation
InventorsTOHRU NAKANISHI, KOSEI TANAHASHI
Life of this patent
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Abstract
There is provided a semiconductor package including: a substrate having a plurality of electrode pads on a surface thereof; a semiconductor chip mounted on the substrate, the semiconductor chip electrically connecting with the plurality of electrode pads; and a stiffener arranged on the substrate so as to surround the semiconductor chip. The stiffener includes: an insulating material layer; and a rigid plate mounted substantially parallel to a surface of the substrate in the insulating material layer, the rigid plate having formed therein a plurality of through holes, at least a part of the through holes being filled with the insulating material.
Claims12
A semiconductor package comprising:
- a substrate having a plurality of electrode pads on a surface thereof;
- a semiconductor chip mounted on the substrate, the semiconductor chip electrically connecting with the plurality of electrode pads;
- and
- a stiffener arranged on the substrate so as to surround the semiconductor chip,
- wherein the stiffener comprises:
- a layer comprising an insulating material;
- and
- a rigid plate mounted substantially parallel to the surface of the substrate in the insulating material layer, the rigid plate having formed therein a plurality of through holes, at least a part of the through holes being filled with the insulating material.
Dependencies are inferred from the claim text.