Backside release and/or encapsulation of microelectromechanical structures and method of manufacturing same
OwnerMarkus Lutz, Aaron Partridge +1inventors
InventorsMarkus Lutz, Aaron Partridge, Paul Merritt Hagelin
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Abstract
There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical structures or elements, for example, accelerometer, gyroscope or other transducer (for example, pressure sensor, strain sensor, tactile sensor, magnetic sensor and/or temperature sensor), filter or resonator. The fabricating or manufacturing microelectromechanical systems of the present invention, and the systems manufactured thereby, employ backside substrate release and/or seal or encapsulation techniques.
Claims76
1-45. (canceled)
A microelectromechanical device comprising:
- a first substrate;
- a chamber;
- a micromachined mechanical structure partially disposed in the chamber;
- a sacrificial layer disposed on top of or beneath the micromachined mechanical structure;
- a cover disposed over both the micromachined mechanical structure and the first substrate, wherein a surface of the cover forms a wall of the chamber;
- and
- one or more backside vents formed in the first substrate and providing access to at least a portion of the micromachined mechanical structure,
- wherein the at least a portion of the micromachined mechanical structure is released by removing at least a portion of the sacrificial layer.
A method for manufacturing a microelectromechanical device, the method comprising:
- forming a micromachined mechanical structure on top of a substrate;
- providing a top sacrificial layer over the micromachined mechanical structure;
- providing a cover over the top sacrificial layer;
- forming one or more backside vents in the substrate;
- and
- removing the top sacrificial layer through the one or more backside vents to release at least a portion of the micromachined mechanical structure, thereby forming a chamber, wherein a surface of the cover forms a wall of the chamber and at least a portion of the micromachined mechanical structure is disposed in the chamber.
A method for manufacturing a microelectromechanical device, the method comprising:
- providing a base sacrificial layer on a substrate;
- providing a semiconductor layer on the base sacrificial layer;
- forming a micromachined mechanical structure from at least a portion of the semiconductor layer;
- providing a cover over the micromachined mechanical structure;
- forming one or more backside vents in the substrate;
- and
- removing the base sacrificial layer through the one or more backside vents to release at least a portion of the micromachined mechanical structure, thereby forming a chamber, wherein at least a portion of the micromachined mechanical structure is disposed in the chamber.
Dependencies are inferred from the claim text.