Semiconductor package and stacked layer type semiconductor package
AssigneeShinko Electric Industries Co., Ltd.
InventorsTakaharu Yamano, Tsuyoshi Kobayashi
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Abstract
In a stacked layer type semiconductor package constructed by stacking a plurality of packages with each other, the plurality of packages include a semiconductor package including: a semiconductor chip; a substrate in which a concave portion has been formed, the semiconductor chip being mounted in the concave portion; and a wiring line structure constructed in such a manner that the wiring line structure can be externally connected to the semiconductor chip at least just above and just under the semiconductor chip.
Claims8
A semiconductor package comprising:
- a semiconductor chip;
- a substrate provided with a concave portion in which the semiconductor chip is mounted;
- and
- a wiring line structure constructed in such a manner that the wiring line structure can be externally connected to the semiconductor chip at least just above and just under the semiconductor chip.
A stacked layer type semiconductor package constructed by stacking a plurality of packages with each other, wherein
- the plurality of packages which is a semiconductor package, comprising:
- a semiconductor chip;
- a substrate provided with a concave portion in which the semiconductor chip is mounted;
- and
- a wiring line structure constructed in such a manner that the wiring line structure can be externally connected to the semiconductor chip at least just above and just under the semiconductor chip.
Dependencies are inferred from the claim text.