US 2008/0290488 A1Published application

Semiconductor device and a method of manufacturing the same

AssigneeElpida Memory, Inc.

InventorsMasachika Masuda, Toshihiko Usami

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Abstract

Detachably mountable memory card featuring a memory chip(s) and a control chip includes a substrate of an insulating material, conductive layers provided on a first main surface of the substrate, a plurality of external electrode terminals exposed to the opposing, second main surface of the substrate, and conductive portions electrically connecting the conductive layers with corresponding ones of the external electrode terminals. The memory chip(s) and the control chip are electrically connected with ones of the conductive layers. The memory card also includes an encapsulating insulating layer covering the first main surface of the substrate, the fixedly disposed memory and control chips thereon, and the conductive layers, the encapsulating insulating layer having an exposed flat surface representing one main plane surface of the finished memory card, and the second main surface of the substrate representing another main plane surface of the memory card with the exposed external electrode terminals.

Claims8

Dependent claims

A memory card detachably mountable to an electronic apparatus, said memory card comprising:

a substrate of an insulating material having a first main surface and a second main surface opposite to said first main surface;
conductive layers provided on said first main surface of said substrate;
a plurality of external electrode terminals exposed to said second main surface of said substrate;
conductive portions electrically connecting said conductive layers with corresponding ones of said external electrode terminals;
a set of semiconductor chips including a memory chip and a control chip fixed on said first main surface and connected electrically with corresponding ones of said conductive layers;
and
a layer of an encapsulating insulating material covering said first main surface of said substrate as well as said set of semiconductor chips and conductive layers,
wherein said layer of the encapsulating insulating material has an exposed flat surface which represents a second main plane surface of the finished memory card, and said second main surface of said substrate with said plurality of external electrode terminals represents a first main plane surface of the finished memory card with the external electrode terminals exposed to said first main plane surface of the finished memory card so that said plurality of exposed external electrode terminals are brought in contact with corresponding electrode terminals of the electronic apparatus when the memory card is detachably mounted to the electronic apparatus.

5 more elements

A memory card for an electronic apparatus, said memory card comprising:

a substrate of an insulating material having a first main surface and a second main surface opposite to said fir main surface;
conductive layers provided on said first main surface of said substrate;
a plurality of external electrode terminals exposed to said second main surface of said substrate;
conductive portions electrically connecting said conductive layers with corresponding ones of said external electrode terminals;
a set of semiconductor chips including at least one memory chip and a spaced apart control chip which are fixed on said first main surface and connected electrically with corresponding ones of said conductive layers, respectively;
and
a layer of an encapsulating insulating material covering said first main surface of said substrate as well as said set of semiconductor chips and conductive layers,
wherein said layer of the encapsulating insulating material has an exposed flat surface which represents a second main plane surface of the finished memory card, and said second main surface of said substrate with said plurality of external electrode terminals represents a first main plane surface of the finished memory card, said plurality of exposed external electrode terminals being brought in contact with corresponding electrode terminals of the electronic apparatus when the memory card is mounted to the electronic apparatus.

5 more elements

Dependencies are inferred from the claim text.

Facts

Application: 12/033,170Filed 19 Feb 2008
Priority: JP 00-02280231 Jan 2000
Published: 27 Nov 2008
Term ends: Not estimatedThe source records don’t support an estimate.

Classification35 codes

H10W 90/00
Package configurations
B82Y 10/00
Nanotechnology for information processing, storage or transmission
G06K 19/077
With integrated circuit chips: constructional details, e.g. mounting of circuits in the carrier
G06K 19/07732
Physical layout of the record carrier: the record carrier having a housing or construction similar to well-known portable memory devices, such as…

Family

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