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US 2008/0290487 A1Published application
Lead frame for semiconductor device
AssigneeFreescale Semiconductor, Inc.
InventorsLi-Guo ZHAO, Zhe Li, Zhi-Jie Wang, Guo-Ping Lu
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AssigneeFreescale Semiconductor, Inc.
InventorsLi-Guo ZHAO, Zhe Li, Zhi-Jie Wang, Guo-Ping Lu
Estimating the term…
A lead frame for a semiconductor device includes at least one row of contact terminals and a die pad for receiving an integrated circuit die. An isolation material is located between the contact terminals and the die pad. The isolation material electrically isolates adjacent lead fingers from each other and from the die pad. The isolation material also holds the lead fingers in place during a wire bonding operation and thus the bottom of the lead frame does not have to be taped during the assembly process, which saves taping and detaping steps from being performed. The isolation material also prevents resin bleed problems that sometimes occur when using tape. If a sawing step is performed, the saw need only cut through the isolation material instead of a metal, and thus saw blade life is improved.
A lead frame for a semiconductor device, the lead frame comprising:
The lead frame of claim 3, wherein the isolation material is one of polycarbonate, polytetrafluorethylene and polycaprolactam.
A semiconductor device, comprising:
The present invention further comprises a method of packaging a semiconductor device comprising the steps of:
Dependencies are inferred from the claim text.