Leadframe package
AssigneeMediatek Inc.
InventorsNan-Jang Chen, Hong-Chin Lin
Life of this patent
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Abstract
A leadframe package includes a die pad with four unitary, outwardly extending slender bars; a plurality of leads arranged along periphery of the die pad; a separate pad segment separated from the die pad and isolated from the plurality of leads; a semiconductor die mounted on an upper side of the die pad, wherein the semiconductor die contains first bond pads wire-bonded to respective the plurality of leads and a second bond pad wire-bonded to the separate pad segment; and a molding compound encapsulating the semiconductor die, the upper side of the die pad, the first suspended pad segment and inner portions of the plurality of leads.
Claims19
A leadframe package comprising:
- a die pad;
- a semiconductor die attached to the die pad;
- a plurality of leads disposed along four peripheral edges of the die pad;
- a first exposed pad segment disposed between the plurality of leads and the die pad;
- a second exposed pad segment being spaced apart from the first exposed pad segment and being disposed between the first exposed pad segment and the die pad;
- conductive wires electrically connected to and extending between the semiconductor die and respective ones of the leads, the first exposed pad segment and the second exposed pad segment;
- and
- a molding compound at least partially encapsulating the die pad, the leads, the first exposed pad segment, the second exposed pad segment and the conductive wires, wherein bottom surfaces of the die pad, the first exposed pad segment and the second exposed pad segment are exposed within the molding compound.
A leadframe comprising:
- a die pad for mounting a semiconductor die thereon;
- a plurality of leads disposed along four peripheral edges of the die pad;
- a first pad segment disposed between the plurality of leads and the die pad, wherein the first pad segment juts out from one of the four peripheral edges of the die pad;
- and
- a second pad segment being spaced apart from the first exposed pad segment and being disposed between the first exposed pad segment and the die pad.
Dependencies are inferred from the claim text.