Integrated circuit package system with relief
AssigneeSTATS ChipPAC, Ltd.
InventorsIl Kwon Shim, Jeffrey D. Punzalan, Henry Descalzo Bathan
Life of this patent
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Abstract
An integrated circuit package system including: providing a die pad with a top, sides, and a bottom, the bottom having a relief with a flat surface and defining a wall and a center pad; mounting a barrier under the bottom of the die pad; mounting an integrated circuit die on the top of the die pad; encapsulating the integrated circuit die and the top and sides of the die pad with the wall preventing encapsulation from flowing along the barrier to reach the center pad; and mounting an external interconnect on the center pad.
Claims20
An integrated circuit package system comprising:
- providing a die pad with a top, sides, and a bottom, the bottom having a relief with a flat surface and defining a wall and a center pad;
- mounting a barrier under the bottom of the die pad;
- mounting an integrated circuit die on the top of the die pad;
- encapsulating the integrated circuit die and the top and sides of the die pad with the wall preventing encapsulation from flowing along the barrier to reach the center pad;
- and
- mounting an external interconnect on the center pad.
An integrated circuit package system comprising:
- providing a die pad with a top, sides, and a bottom, the bottom having a relief with a flat surface and defining a wall and multiple center pads;
- mounting a barrier under the bottom of the die pad;
- mounting an integrated circuit die on the top of the die pad;
- encapsulating the integrated circuit die and the top and sides of the die pad with the wall preventing encapsulation from flowing along the barrier to reach the center pad;
- and
- mounting a solder bump on the center pad.
An integrated circuit package system comprising:
- a die pad with a top, sides, and a bottom, the bottom having a relief with a flat surface and defining a wall and a center pad;
- a barrier mounted under the bottom of the die pad;
- an integrated circuit die mounted on the top of the die pad;
- an encapsulation encapsulating the integrated circuit die and the top and sides of the die pad with the wall preventing the encapsulation from reaching the center pad;
- and
- an external interconnect mounted on the center pad.
Dependencies are inferred from the claim text.