Method of packaging integrated circuits

A method of packaging integrated circuit dice into exposed die packages, the method comprising:

• depositing a metallic layer onto a back surface of an integrated circuit wafer, the wafer including a multiplicity of integrated circuit dice formed therein, each die having an active surface and a back surface, each active surface including a plurality of bond pads formed thereon, each back surface being substantially opposite the active surface, the back surfaces of the dice cooperating to form the back surface of the wafer, the metallic layer being deposited such that the metallic layer substantially covers the back surface of the wafer;
• and
• applying a protective layer of high temperature paint over the metallic layer such that the protective layer of high temperature paint substantially covers the metallic layer.

A method of packaging integrated circuit dice into exposed die packages, the method comprising:

• depositing a metallic layer onto a back surface of an integrated circuit wafer, the wafer including a multiplicity of integrated circuit dice formed therein, each die having an active surface and a back surface, each active surface including a plurality of bond pads formed thereon, each back surface being substantially opposite the active surface, the back surfaces of the dice cooperating to form the back surface of the wafer, the metallic layer being deposited such that the metallic layer substantially covers the back surface of the wafer;
• and
• applying a protective layer of a water-based emulsion over the metallic layer such that the protective layer of water-based emulsion substantially covers the metallic layer.

An arrangement, comprising:

• a lead frame panel including at least one two-dimensional array of device areas, adjacent device areas being connected with associated tie bars, each device area being suitable to receive an associated die;
• and
• a plurality of dice, the dice being electrically connected to associated devices areas of the lead frame panel, each die including a metallic layer deposited onto the back surface of the die such that the metallic layer substantially covers the back surface of the die, each die additionally including a protective layer applied over the metallic layer such that the protective layer substantially covers the metallic layer.