Lead-frame array package structure and method

A semiconductor package structure comprising:

• a lead-frame formed in accordance with a plurality of shorter leads and a plurality of longer leads, and the shorter leads and the longer leads are respectively and alternatively paralleled to form a first surface and a second surface, a geographic shape is formed at the end of each of the plurality of longer leads, the ends with the geographic shape are disposed at the same horizontal as the end of each of the shorter leads;
• a chip fixedly connected to the first surface of the lead-frame by a adhesive layer and including an active layer, one side of the active layer having a plurality of metal pads disposed thereon;
• a plurality metal leads used to electrically connect the metal pads on the chip and the leads on the lead-frame;
• an encapsulant material used to cover the chip, the metal leads and the first surface and the second surface of the lead frame lead-frame, and expose a portion of the metal of the leads;
• and
• a plurality of conductive elements electrically connected to the exposed metal of the leads and formed an array deploy on the second surface of the leads.

A semiconductor package structure comprising:

• a lead-frame formed in accordance with a plurality of first leads and a plurality of second leads, and the first leads and the second leads are used to form a first surface and a second surface, the first leads and the second leads have a plurality of longer leads and a plurality of shorter leads, the longer leads and the shorter leads are respectively and alternatively paralleled, a geographic shape is formed at the end of each of the longer leads, the ends with the geographic shape are disposed at the same horizontal as the end of each of the shorter leads;
• a chip fixedly connected to the first surface of the lead-frame by a adhesive layer and including an active layer, two corresponding side of the active layer having a plurality of metal pads disposed thereon;
• a plurality metal leads used to electrically connect the metal pads on the chip and the leads on the lead-frame;
• an encapsulant material used to cover the chip, the metal leads and the first surface and the second surface of the lead-frame, and expose a portion of the metal of the leads;
• and
• a plurality of conductive elements electrically connected to the exposed metal of the leads and formed a dual row deploy on the second surface of the leads.

A lead-frame package method comprising:

• forming a lead-frame in accordance with a plurality of shorter leads and a plurality of longer leads, and the shorter leads and the longer leads are respectively and alternatively paralleled to form a first surface and a second surface, a geographic shape is formed at the end of each of the longer leads, the end with the geographic shape is disposed at the same horizontal as the end of each of the shorter leads;
• fixedly connecting a chip to the first surface of the lead-frame by a adhesive layer and the chip has an active layer, one side of the active layer having a plurality of metal pads disposed thereon;
• executing a wire bonding process to electrically connect a plurality of metal leads to the metal pads on the chip and the plurality of leads on the lead-frame;
• executing an encapsulated process to cover the chip, the metal leads and the first surface and the second surface of the lead-frame by an encapsulant material;
• exposing a portion of the metal of the second leads of the lead-frame by removing the encapsulant material on each end of the leads in accordance with a removing process;
• and
• forming a plurality of conductive elements on the exposed metal leads and the conductive elements are used to electrically connected to the exposed metal leads.