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US 2008/0290458 A1Published application
Post last wiring level inductor using patterned plate process
AssigneeInternational Business Machines Corporation
InventorsAnil Kumar Chinthakindi, Douglas Duane Coolbaugh, John Edward Florkey, Jeffrey Peter Gambino, Zhong-Xiang He, Anthony Kendall Stamper, Kunal Vaed
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Abstract
A semiconductor structure. The semiconductor structure includes: a substrate having at least one metal wiring level within the substrate; an insulative layer on a surface of the substrate; an inductor within the insulative layer; and a wire bond pad within the insulative layer. The inductor and the wire bond pad are substantially co-planar. The inductor has a height greater than a height of the wire bond pad.
Claims11
A semiconductor structure, comprising:
- a substrate having a metal wiring level within the substrate;
- a capping layer on and above a top surface of the substrate;
- an insulative layer on and above a top surface of the capping layer;
- an inductor comprising a first portion in and above the insulative layer and a second portion in and above the insulative layer;
- and
- a wire bond pad within the insulative layer, wherein the first portion the inductor has a height in a first direction greater than a height of the wire bond pad in the first direction, wherein the first direction is perpendicularly directed from the top surface of substrate toward the insulative layer.
3 more elements
4-5. (canceled)
Dependencies are inferred from the claim text.