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US 2008/0290455 A1Published application
Semiconductor device and method of blowing fuse thereof
AssigneeNEC Electronics Corporation
InventorHiroyuki Furukawa
Life of this patent
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Abstract
A semiconductor device comprises an active region including a core circuit forming region and a buffer forming region, and a fuse element forming region arranged on a corner of the active region and to be able to be electrically fused. It is possible to arrange the fuse element without forming the fuse in the core circuit forming region by arranging the fuse element forming region at the corner of the active region.
Claims10
A semiconductor device comprising:
- an active region including a core circuit forming region and a buffer forming region;
- and
- a fuse element forming region arranged on a corner of the active region and to be able to be electrically fused.
A method of blowing a fuse of a semiconductor device comprising:
- arranging a fuse element forming region at a corner of a semiconductor chip;
- electrically connecting a plurality of pads formed near a corner of the semiconductor chip with fuses of the fuse element forming region;
- and
- blowing the fuse by applying voltage to the plurality pads by probing.
1 more element
A semiconductor device comprising:
- a first pad, the first pad is not bonded to an external terminal;
- a second pad, the second pad is not bonded to the external terminal;
- and
- a fuse element, the fuse element is coupled to the first and the second pads.
1 more element
Dependencies are inferred from the claim text.