Light emitting device and manufacturing method of the same

A method of manufacturing a light emitting device, the method comprising:

• providing a plurality of light emitting diode chips each having an electrode surface where both electrodes are formed, and a plurality of external terminal blocks, each of the external terminal blocks having an electrical contact part exposed on at least one surface;
• attaching the external terminal blocks and the light emitting diode chips on a first sheet such that the electrode surface and an exposed surface of the electrical contact part are located at a top and each of the light emitting diode chips is disposed between the external terminal blocks;
• connecting the electrodes of the light emitting diode chip to exposed surfaces of the electrical contact parts of adjacent ones of the external terminal blocks by wires, respectively;
• attaching a spacer on the first sheet to surround an arrangement area of the external terminal blocks and the light emitting diode chips, the spacer having a height greater than a height of the wires and having at least one inlet formed therein;
• attaching a second sheet on the spacer to produce a chip array structure having an inner space including the arrangement area;
• disposing the chip array structure inside a chamber and decompressing the chamber inside to allow the inner space of the chip array structure to be in one of a low pressure and vacuum state;
• disposing a curable liquid resin in an area adjacent to the inlet of the spacer to seal the inner space thereof while the chamber is decompressed;
• reverting the one of the low pressure and vacuum state of the chamber back to an original state to allow the curable liquid resin to be filled in the inner space of the spacer through the inlet;
• curing the curable liquid resin filled inside the chip array structure;
• and
• cutting the chip array structure into a desired size to obtain a plurality of light emitting devices.

A light emitting device comprising:

• a package body having a first circumferential surface, a second circumferential surface and a plurality of side surfaces formed therebetween, the package body defined into first and second level areas including the first and second circumferential surfaces, respectively, and formed of a curable resin;
• first and second external terminal blocks disposed at both edges of the package body, respectively, each of the first and second external terminal blocks having a first surface exposed to the first circumferential surface of the package body, a second surface opposing the first surface and side surfaces disposed therebetween, and having an electrical contact part extended from inside of the package body to an exposed portion of the first surface;
• a light emitting diode chip disposed between the first and second external terminal blocks in the first level area and having an electrode surface where first and second electrodes are formed, the electrode surface facing the second level area;
• and
• wires electrically connected to first and second electrodes of the light emitting diode chip to the electrical contact parts of the first and second external terminal blocks, respectively.