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US 2008/0290342 A1Published application
Methods and apparatus for a flexible circuit interposer
AssigneeMicron Technology, Inc.
InventorDouglas C. Chambers
Life of this patent
Estimating the term…
Abstract
A substrate having a bending region and conductive paths formed therethrough is provided. In one embodiment, conductive paths are formed from a first region on the bottom surface of the substrate, through the bending region and to a second region on the top surface of the substrate. Methods of using the flexible substrate are also provided.
Claims22
A substrate comprising:
- a top surface;
- a bottom surface;
- a bending region formed between a first end of the substrate and a second end of the substrate, wherein the bending region is configured to elastically deform;
- and
- one or more conductive paths from a first region on the bottom surface and the first end of the substrate to a second region on the top surface and the second end of the substrate.
2 more elements
A system comprising:
- a system board;
- a first semiconductor device;
- and
- an interposer having a top surface coupled to the first semiconductor device and a bottom surface coupled to the system board, wherein the interposer is configured to electrically couple the system board to the first semiconductor device, and wherein the interposer comprises a bending region arranged between the system board and the semiconductor device.
1 more element
A method of using a flexible circuit interposer comprising:
- providing a flexible circuit interposer including:
- a substantially flexible substrate having a top surface and a bottom surface;
- a first set of electrical connections formed on the bottom surface and at a first end of the substrate;
- and
- a second set of electrical connections formed on the top surface and at a second end of the substrate, and wherein the first set of electrical connections is electrically linked to the second set of electrical connections;
- attaching the first set of electrical connections of the flexible circuit interposer to a circuit board;
- and
- attaching the second set of electrical connections of the flexible circuit interposer to a semiconductor device.
5 more elements
Dependencies are inferred from the claim text.