US 2008/0290291 A1 · Charged Particle Beam Processing Apparatus

Abstract

In view of the fact that in line processing, when processing is performed to a certain depth, the processing does not advance with the passage of a further processing time, a processing apparatus is provided which can appropriately control the depth of grooves in linear groove processing and perform the processing at high speed. A line width and line depth are calculated so as to minimize a processing time of processing on a line to a required depth and processing is performed using the width and line depth as set values of processing. Furthermore, processing is performed with the area in which the beam is actually irradiated superimposed on the scanned image of a focused ion beam and displayed on a screen. In the case of an ion beam inclined with respect to the sample surface, processing is also performed by displaying the area where the beam is actually irradiated by taking the inclination of the sample with respect to the beam into consideration.

Claims16

Dependent claims

A charged particle beam processing apparatus that processes a sample using a charged particle beam, comprising:

a stage that moves the sample in a desired axial direction;
a charged particle beam column that radiates a charged particle beam onto the sample;
a control section that controls the charged particle beam column;
and
a calculation section that calculates a set value H of a depth for line creation (V groove) and a set value W of a width for the line creation (V groove) from an inputted desired line segment length L and a desired depth d for the line creation (V groove),
wherein the calculation section calculates a condition that minimizes a processing time t based on an arithmetic expression for a processing time t expressed by the set value H of the depth for the line creation and the set value W of the width for the line creation, length L for the line creation, sputtering yield Y(O) of matter and beam current Ib and thereby obtains the set values H and W, and
the control section causes the charged particle beam to be radiated onto the surface of the sample based on the set values H and W calculated by the calculation section and the length L for the line creation so as to form V grooves on a surface of the sample.

4 more elements

A charged particle beam processing apparatus that processes a sample using a charged particle beam, comprising:

a stage that moves the sample in a desired axial direction;
a charged particle beam column that radiates a charged particle beam onto the sample;
a control section that controls the charged particle beam column;
a display control section that displays a sample image on a display section;
and
a calculation section that calculates a set value of a depth H for line creation (V groove) and a set value of a width W for the line creation (V groove) from an inputted desired line segment length L (length when viewed from an radiation direction) and a desired depth d for the line creation (depth when viewed from the radiation direction),
wherein the calculation section calculates a condition that minimizes a processing time t based on a following arithmetic expression indicating the processing time t expressed by the depth H of the groove, width W of the V groove, length L of the V groove and sputtering yield Y(0) of matter and beam current Ib and thereby determines the set values H and W,
t
=
H
·
W
·
L
Ib
·
Y

(
0
)
[
Formula


5
]
the time obtained by the arithmetic expression is designated as the processing time t,
the control section causes the charged particle beam to be radiated onto a process area displayed by the length L and the width W for the line creation for the processing time t and performs linear (V groove) creation of length L, width W, depth d for the line creation as a result of the radiation, and
the display control section superimposes the process area expressed by the width W and the length L together with the depth H, the line width W and the value of length L for the line creation which are the set values on the sample image and displays the area on the display section.

27 more elements

Dependencies are inferred from the claim text.

Charged Particle Beam Processing Apparatus

Life of this patent

Charged Particle Beam Processing Apparatus

Life of this patent

Abstract

Claims16