Solder supplying method
AssigneeShinko Electric Industries Co., Ltd.
InventorKei Murayama
Life of this patent
Estimating the term…
Abstract
Amounts of a solder are controlled to supply onto the respective connection terminals with different opening diameters such that a difference between contents of a substance diffused from the connection terminals into the solder, which is present in the solder after reflow on the connection terminals with the different opening diameters becomes equal to or smaller than 0.2 wt %.
Claims7
A method of supplying a solder to connection terminals having different opening diameters of a substrate, said method comprising a step of:
- controlling amounts of the solder to supply onto the respective connection terminals such that a difference between contents of a substance diffused from the connection terminals into the solder by reflow, which is present in the solder after reflow on the connection terminals having the different opening diameters, becomes equal to or smaller than 0.2 wt %.
A method of supplying a solder to connection terminals having different opening diameters of a substrate, said method comprising steps of:
- forming the connection terminals having different opening diameters on the substrate by controlling a thickness of the connection terminals such that a difference between contents of a substance diffused from the connection terminals into the solder by reflow, which is present in the solder after reflow on the connection terminals having the different opening diameters, becomes equal to or smaller than 0.2 wt %;
- and
- supplying the solder to the respective connection terminals.
Dependencies are inferred from the claim text.