Novel via structure for improving signal integrity

A via structure, comprising:

• a power plane (or ground via) connects with another power plane (or ground via) through a power via (or ground via);
• a power via (or a ground via) that connects the power planes (or ground planes);
• and
• a signal via surrounds the power via (or ground via);
• wherein the power via (or ground via) passes through at least three layers (proper combination of signal layer, medium layer, power layer, and ground layer) of circuit structure along the same axis.

A method for forming a via, comprising the steps of:

• forming a via;
• and
• enclosing the via (for connecting the signal traces) in a conductive via (for connecting planes with the same potential);
• or
• enclosing a conductive via (for connecting planes with the same potential) in a via (for connecting signal traces);
• or
• enclosing a via (for connecting the signal traces) with two conductive vias (for connecting planes with the same potential), one conductive via is inside the other via;
• the other conductive via being outside this via.

A via structure, comprising:

• the power plane (or the ground plane) that connects to other power planes (or ground planes) through a power via (or a ground via);
• a power via and a ground via that connects the power planes and ground planes, respectively;
• and
• a power via (or a ground via) that surrounds the ground via (or the power via);
• wherein the power via (or the ground via) connects with at least two power planes (or at least two ground planes), and passes through the ground planes (or the power planes), and the medium layers along the same axis.