Printed wiring board and method for producing the same

A printed wiring board comprising:

• a core substrate;
• a lower conductor circuit formed over the core substrate;
• a lower interlayer resin insulation layer formed over the lower conductor circuit;
• an upper conductor circuit formed over the lower interlayer resin insulation layer;
• a metal layer formed on at least a part of a surface of the upper conductor circuit and comprising at least one metal selected from the group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Hf, Ta, W, Re, Os, Ir, Pt, Au, Rf, Db, Sg, Bh, Hs, Mt, Ds, Rg, Al and Sn;
• and
• an upper interlayer resin insulation layer formed over the upper conductor circuit and the metal layer.