Heat dissipation device with a heat pipe

Abstract

A heat dissipation device includes a plurality of first fins and second fins, a flattened heat pipe and a base plate. The first fins include a first face at a bottom thereof. The second fins are sandwiched between the first fins and have a second face at a bottom thereof. The heat pipe includes a first section, a second section and a connecting section connecting the first section with the second section. The first section and the second section thermally contact the second face of the second fins. The connecting section thermally contacts the first face of the first fins. The base plate has a bottom surface adapted for contacting a heat-generating electronic component, and a top surface contacting the second face of the second fins and the first section and the second section of the heat pipe.

Dependencies are inferred from the claim text.