Heat dissipation device with heat pipes
AssigneeFoxconn Technology Co., Ltd.
InventorsXU-XIN MIN, MENG FU, CHUN-CHI CHEN
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AssigneeFoxconn Technology Co., Ltd.
InventorsXU-XIN MIN, MENG FU, CHUN-CHI CHEN
Estimating the term…
A heat dissipation device adapted for dissipating heat from a heat-generating device includes a heat pipe assembly and a fin set. The heat pipe assembly is adapted for absorbing heat from the heat-generating device, and includes a plurality of bending heat pipes each having a top face and a bottom face. The fin set thermally engaged with the heat pipe assembly includes a plurality of fins and has a bottom surface cooperatively formed by bottom edges of the fins. The heat pipes of the heat pipe assembly are juxtaposed with each other; the top faces of the heat pipes are thermally attached to the bottom surface of the fin set; the bottom faces of the heat pipes are positioned level with each other to form a contacting surface for contacting with the heat generating device.
A heat dissipation device adapted for dissipating heat from a heat-generating device, comprising:
A heat dissipation device comprising:
Dependencies are inferred from the claim text.