Heat-curable fluoropolyether adhesive composition and bonding method
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsHidenori Koshikawa, Mikio Shiono, Hiroyasu Hara, Takashi Aketa
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Abstract
A heat-curable fluoropolyether adhesive composition comprising (A) a linear polyfluoro compound having at least two alkenyl groups and a perfluoropolyether structure, (B) a fluorinated organohydrogensiloxane having at least two SiH groups, (C) a platinum group metal catalyst, (D) an organosiloxane having at least one SiH group and at least one epoxy and/or trialkoxysilyl group, and (E) a compound having at least two allyloxycarbonyl groups can be cured to metal and plastic substrates by heating at a temperature from 20° C. to less than 100° C.
Claims8
A heat-curable fluoropolyether adhesive composition comprising
- (A) 100 parts by weight of a linear polyfluoro compound having at least two alkenyl groups per molecule and a perfluoropolyether structure in its main chain,
- (B) a fluorinated organohydrogensiloxane having at least two silicon-bonded hydrogen atoms (i.e., SiH groups) per molecule, in an amount to provide 0.5 to 3.0 moles of SiH groups per mole of alkenyl groups on component (A),
- (C) a platinum group metal-based catalyst in an amount to provide 0.1 to 500 ppm of platinum group metal,
- (D) 0.1 to 10 parts by weight of an organosiloxane having per molecule at least one silicon-bonded hydrogen atom and at least one group selected from among epoxy groups and trialkoxysilyl groups which is bonded to a silicon atom through a carbon atom or through carbon and oxygen atoms, and
- (E) 0.01 to 5 parts by weight of a compound having at least two allyloxycarbonyl (CH2′CHCH2OC(═O)—) groups per molecule.
Dependencies are inferred from the claim text.