Process for forming an isolated electrically conductive contact through a metal package
AssigneeElectro Scientific Industries, Inc.
InventorsMichael Nashner, Jeff Howerton
Life of this patent
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Abstract
A method of forming an isolated electrically conductive contact through a metal substrate by creating at least one via through the substrate. The at least one sidewall of the via is cleaned and coated with a non-conductive layer. In one example, the non-conductive layer is formed by anodizing the sidewall(s) of the via. In another example, the non-conductive layer may be formed by thin film deposition of a dielectric on the sidewall(s). An electrically conductive filler is then placed into the via. In the examples disclosed, the filler may be a conductive ink or a conductive epoxy.
Claims20
A method of creating an electrically isolated contact comprising:
- forming a via in a metallic substrate wherein the via includes at least one sidewall;
- forming a dielectric sleeve on the at least one sidewall of the via;
- and
- filling the via with an electrically conductive material.
A housing having an isolated electrical contact wherein the isolated electrical contact comprises:
- a via having an electrically insulating sleeve formed on a via sidewall and a conductive filler captured by the insulating sleeve of the via sidewall.
A housing made from a metal and having an isolated electrical contact wherein the isolated electrical contact is formed by a method comprising:
- forming a via in the housing, the via including at least one sidewall;
- cleaning the housing and the at least one sidewall;
- anodizing the housing and the at least one sidewall;
- and
- filling the via with an electrically conductive filler.
Dependencies are inferred from the claim text.