Method of manufacturing a piezoelectric vibrator
AssigneeEpson Toyocom Corporation
InventorsTsuyoshi Ohshima, Shin Hasegawa, Norlyuki Watanabe
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Abstract
A piezoelectric vibration element is provided which includes a piezoelectric substrate formed of a thickness slip based piezoelectric material and a metal layer formed on a surface of the piezoelectric substrate. In the piezoelectric vibration element, a surface of the metal layer is covered by a layer formed by chemical absorption with a material having a nonbonding electron pair.
Claims4
A method of manufacturing a piezoelectric vibrator, comprising:
- supporting a piezoelectric vibration element in a case by means of a conductive bonding member, the piezoelectric vibration element having a metal layer formed on a surface of a piezoelectric substrate formed of a thickness slip based piezoelectric material;
- adding or reducing a thickness of the metal layer so as to adjust a resonant frequency of the piezoelectric vibration element to a predetermined value;
- leaving the case by which the piezoelectric vibration element is held into an atmosphere filled with vapor of a material having a nonbonding electron pair, and making the resultantly exposed metal layer subject to chemical absorption with the material having the nonbonding electron pair;
- and
- hermetically encapsulating the case in a state substituted by an inert gas atmosphere.
A method of manufacturing a piezoelectric vibrator, comprising:
- supporting a piezoelectric vibration element in a case by means of a silicon based conductive adhesive, the piezoelectric vibration element having a metal layer formed on a surface of a piezoelectric substrate formed of a thickness slip based piezoelectric material;
- adding or reducing a thickness of the metal layer to adjust a resonant frequency of the piezoelectric vibration element to a predetermined value;
- hermetically encapsulating the case in a state substituted by an inert gas atmosphere;
- and
- carrying out heating on the hermetically encapsulated case for a predetermined time, and chemically absorbing a material having a nonbonding electron pair transpirated from the silicon adhesive into the metal layer.
A method of manufacturing a piezoelectric vibrator, comprising:
- supporting a piezoelectric vibration element in a case by means of a silicon based conductive adhesive, the piezoelectric vibration element having a metal layer formed on a surface of a piezoelectric substrate formed of a thickness slip based piezoelectric material;
- adding or reducing a thickness of the metal layer to adjust a resonant frequency of the piezoelectric vibration element to a predetermined value;
- hermetically encapsulating the case in a state substituted by an inert gas atmosphere;
- and
- leaving the hermetically encapsulated case in an atmosphere of temperature K for at least a time T, and chemically absorbing a resultant material having the nonbonding electron pair transpirated from the silicon adhesive into the metal layer,
- wherein relationship between the temperature K and the time T meets T=24294e−0.0251K.
A method of manufacturing a piezoelectric vibrator, comprising:
- supporting a piezoelectric vibration element in a case by means of a silicon based conductive adhesive, the piezoelectric vibration element having a metal layer formed on a surface of a piezoelectric substrate formed of a thickness slip based piezoelectric material;
- adding or reducing a thickness of the metal layer to adjust a resonant frequency of the piezoelectric vibration element to a predetermined value;
- putting a material having a nonbonding electron pair into the case;
- hermetically encapsulating the case in a state substituted by an inert gas atmosphere;
- and
- carrying out heating on the material having the nonbonding electron pair at a temperature required to transpirate the material for a predetermined time, and chemically absorbing the material having the nonbonding electron pair into the metal layer.
Dependencies are inferred from the claim text.