Simultaneous design of integrated circuit and printed circuit board
AssigneeMirror Semiconductor, Inc.
InventorsMartin Hart, Joseph C. Fjelstad
Life of this patent
Estimating the term…
Abstract
A printed circuit board (PCB) circuit assembly is designed utilizing software to create the best performing “total design” by selecting component layout locations, optimizing the circuit routing of the PCB copper (or other metallic) traces, and simultaneously optimizing the interconnections between a “standard” die inside an integrated circuit (IC) package and an interposer substrate of the IC package.
Claims20
A method for designing a printed circuit board (PCB) circuit assembly by simultaneously designing interconnections for an integrated circuit (IC) package having a die chip and a printed circuit board (PCB) onto which the IC package is coupled, comprising:
- accessing a routing pattern from a computer storage, said routing pattern providing the interconnection of at least two components of a desired circuit on a PCB, at least one of the components being an IC package, said routing pattern defining a preliminary circuit design;
- determining if the preliminary circuit design defined by a pattern of interconnections between a die chip and an interposer substrate of the IC package and by the routing pattern between the components on the PCB meet a pre-selected set of criteria stored in a computer readable medium;
- iterating between revising the pattern of interconnections between the die chip and the interposer substrate of the IC package and revising the routing pattern interconnecting components on the PCB until the set of pre-selected criteria are met to provide a final circuit design and outputting said final circuit design to a user;
- and
- outputting digital data files corresponding to the final circuit design to a user, said digital data files usable to document, fabricate, test and assemble the PCB and the IC package.
The method of claim, 1 wherein the interconnections between the die chip and the interposer of the IC package comprise bond wires.
A method for designing a printed circuit board (PCB) circuit assembly by simultaneously designing an integrated circuit (IC) package having a die and a printed circuit board (PCB) onto which the IC package is coupled, comprising:
- creating a schematic of the desired circuit;
- selecting at least two components for said circuit, at least one of said components being an IC package having a die chip;
- evaluating thermal and mechanical placement restrictions for the components;
- defining the input/output configuration of the IC package;
- laying out a pattern of interconnections between the die and an interposer substrate of the IC package;
- defining a position of each of the components on the circuit;
- generating a routing pattern to interconnect the components to define a preliminary circuit design and storing the routing pattern in a computer storage;
- determining if the preliminary circuit design defined by the pattern of interconnections of the IC package and the routing pattern of the PCB meet a pre-selected set of criteria stored in a computer readable medium;
- iterating between revising the pattern of interconnections between the die and the interposer substrate of the IC package and revising the routing pattern interconnecting components on the PCB until the set of pre-selected criteria are met to provide a final circuit design and outputting said final circuit design to a user;
- generating digital data files corresponding to the final circuit design to document, fabricate, test and assemble the PCB and the IC package;
- and
- outputting the digital data files to at least one of a user and an IC wire bonding machine.
A system for designing a printed circuit board (PCB) circuit assembly by simultaneously designing an integrated circuit (IC) package having a die and a printed circuit board (PCB) onto which the IC package is coupled, comprising:
- a computer storage that stores a routing pattern of interconnections between at least two components of a desired circuit on a PCB, at least one of the components being an IC package, the routing pattern defining a preliminary circuit design;
- a computer readable medium that stores a pre-selected set of design criteria;
- and
- a processor programmed to determine if the preliminary circuit design defined by the routing pattern between the components on the PCB and by a pattern of interconnections between a die chip and an interposer substrate of the IC Package meet the pre-selected set of design criteria, the processor configured to iterate between revising the pattern of interconnections between the die chip and the interposer substrate of the IC package and revising the routing pattern interconnecting components on the PCB until the set of pre-selected design criteria are met to provide a final circuit design.
A computer-readable medium having stored thereon instructions that, when executed by a computer, cause the computer to:
- access a routing pattern of interconnections between at least two components of a desired circuit on a PCB, at least one of the components being an IC package, said routing pattern defining a preliminary circuit design;
- determine if the preliminary circuit design defined by a pattern of interconnections between a die chip and an interposer substrate of the IC package and by the routing pattern between the components on the PCB meet a pre-selected set of criteria;
- iterate between revising the pattern of interconnections between the die chip and the interposer substrate of the IC package and revising the routing pattern interconnecting components on the PCB until the set of pre-selected criteria are met to provide a final circuit design;
- and
- output said final circuit design to a user.
Dependencies are inferred from the claim text.