Heat dissipation module and method for fabricating the same
AssigneesAdvanced Connectek Inc., Tysun Inc.
InventorsShun-Tian Lin, Jyun-Wei Huang
Life of this patent
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Abstract
A heat dissipation module including a substrate, a printed circuit board (PCB), and at least one light emitting diode (LED) chip is provided. A surface of the substrate has at least one positioning portion protruding upward. The PCB has at least one positioning hole corresponding to the positioning part. The PCB is disposed on the surface of the substrate, such that the positioning part is located in the positioning hole. The LED chip is disposed on the positioning part and electrically connected to the PCB.
Claims16
A heat dissipation module, comprising:
- a substrate, wherein a surface of the substrate comprises at least one positioning portion protruding upward;
- a printed circuit board (PCB), comprising at least one positioning hole corresponding to the positioning portion, wherein the PCB is disposed on the surface of the substrate, such that the positioning portion is located in the positioning hole;
- and
- at least one LED chip, disposed on the positioning portion, and electrically connected to the PCB.
A method for fabricating a heat dissipation module, comprising:
- providing a substrate, a PCB, and at least one LED chip, wherein a surface of the substrate comprises at least one positioning portion protruding upward, and the PCB comprises at least one positioning hole corresponding to the positioning portion;
- fixing the PCB on the surface of the substrate, such that the positioning portion is accommodated in the positioning hole;
- fixing the LED chip on the positioning portion;
- and
- electrically connecting the LED chip and the PCB.
Dependencies are inferred from the claim text.